Description : RELIFE RL-044 Multi-Functional Steel Stencil Professional BGA Reballing Stencil for Mobile Phone Motherboard IC Repair

The RELIFE RL-044 Multi-Functional Steel Stencil is a premium-grade tool designed for mobile phone motherboard IC repair and reballing. Made from high-quality stainless steel, it ensures superior durability, consistent heat resistance, and precise solder ball placement. Perfect for professionals who need accurate alignment and smooth workflow during BGA reballing, chip replacement, and advanced board-level repairs. Whether you work on iPhone, Android, or other smartphone logic boards, this stencil provides the accuracy and reliability needed for high-success repairs.

Specifications

• Model: RL-044
• Material: High-quality stainless steel
• Type: Multi-Functional IC Reballing Stencil
• Application: Mobile phone motherboard BGA chips
• Durability: Heat-resistant, anti-corrosion
• Thickness: Standard precision stencil thickness
• Brand: RELIFE

Key Features

• High-precision stainless-steel construction
• Multi-functional matrix for various IC chip models
• Heat-resistant and warp-free design
• Ideal for BGA reballing and motherboard chip repair
• Smooth edges for easy solder paste application
• Long-lasting and corrosion-resistant
• Designed for professional mobile phone repair technicians

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Package Included:

1X Original RELIFE RL-044 IC Reballing Multi-Functional Steel Stencil for Mobile Motherboard Chip Repair