Description: MCN UV50 Highly Synthetic Halogen-Free No Clean BGA Solder Paste

MCN UV50 Highly Synthetic Halogen Free No Clean BGA Solder Paste For Soldering Purpose Uses

Features:

Rosin-based Solder Paste.

High synthetic BGA Solder Paste Tin Rosin-Based Flux Paste Cream.

PH value neutral, insulation is strong, welding surface smooth.

Professional Soldering Tin Flux for PC Cards Electronic Chip-level Welding.

Its boiling point only slightly higher than the melting point of the solder.

Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.

Good soldering and welding tools.

IC and PCB for no corrosive

Super compacity: Applicable to PCB, BGA, PGA, SMD repair repair, Soldering, etc.

Specification:

Material: Plastic+ Rosin-based solder paste

Size: for MCN UV50 35gm

Type: Rosin-based BGA solder flux cream

Model Number: UV50 optional

Viscosity: 0.2Pas

Granularity: 0.22um

weight : 35 gm

Note:

Harmful by inhalation and if swallowed.

Danger of cumulative effects.

Keep away from food,drink and animal feeding stuffs.

When using do not eat,Drink or smoke.

Avoid prolonged or repeated contact of any skin with solder paste. In case of solder paste ingestion see a doctor immediately.

Store container well closed and cool.

Package Include:

1 x MCN UV50 Highly Synthetic Halogen-Free No Clean BGA Solder Paste

• Material: Plastic+ Rosin-based solder paste
• Size: for MCN UV50 35gm
• Type: Rosin-based BGA solder flux cream
• Model Number: UV50 optional
• Viscosity: 0.2Pas
• Granularity: 0.22um
• weight : 35 gm