Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit
Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit
Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit
Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit
Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit
Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit
Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit
Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit
Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit
Picture of MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit

MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit

Category:
SKU: MOS896038
Seller: Module Shop
Tk 250
0 review(s)
  • BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template
  • High Quality Stainless Steel BGA Reballing Stencil.
  • Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR
  • Make your repair work easier.
  • Color : Silver
  • Feature : Square Hole -We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.

Call For Order : 09613-800800
  • BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template
  • High Quality Stainless Steel BGA Reballing Stencil.
  • Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR
  • Make your repair work easier.
  • Color : Silver
  • Feature : Square Hole -We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.





  • BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template
  • High Quality Stainless Steel BGA Reballing Stencil.
  • Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR
  • Make your repair work easier.
  • Color : Silver
  • Feature : Square Hole -We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.
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